Bundle Contents

• Motherboard: ASUS PRIME B550M-A WIFI II Micro-ATX AM4 Motherboard

• Processor: AMD Ryzen 7 5700X 8-Core AM4 Processor

• Memory: Kingbank 32GB (2 x 16GB) DDR4 3200MHz CL16 KJXB Memory Kit

Motherboard Overview

The ASUS PRIME B550M-A WIFI II is a Micro-ATX motherboard designed to provide a solid foundation for daily users and DIY builders looking for reliable AM4 performance. Built on the AMD B550 chipset, it features robust power design, comprehensive cooling solutions, and intelligent tuning options via intuitive software and firmware features.

Engineered with ASUS Fan Xpert 2+ and Digi+ VRM control, it ensures optimal thermal and power efficiency under load. This versatile board features built-in high-speed Wi-Fi 6, PCIe 4.0 support for fast graphics card and M.2 SSD performance, and addressable Gen 2 RGB headers that integrate seamlessly with ASUS Aura Sync to illuminate your setup.

Processor Overview

The AMD Ryzen 7 5700X is a highly efficient, high-performance desktop processor featuring 8 cores and 16 threads, optimized for mainstream gaming and content creation. Packing a generous 36MB of total cache, it delivers the processing muscle required to breeze through multi-threaded workloads, video editing, and modern gaming titles alike.

Built on AMD's mature 7nm "Zen 3" architecture, the Ryzen 7 5700X stands out for its exceptional power efficiency, operating at a modest 65W TDP. It features a base clock of 3.4GHz with boost speeds up to 4.6GHz, and natively supports Precision Boost Overdrive (PBO) alongside AMD Ryzen Master utility for straightforward performance tuning and system optimization.

Memory Overview

The Kingbank KJXB is a reliable DDR4 3200MHz memory kit meticulously built to ensure excellent compatibility and stable throughput on modern DDR4 computing systems. Operating at standard DDR4 voltages with a snappy CL16 timing rating, this 32GB (2x16GB) non-ECC unbuffered DIMM kit provides ample bandwidth and memory capacity for fluent multitasking, streaming, and productivity tasks.

Equipped with a clean, low-profile aluminum alloy heatspreader, it quickly dissipates thermal buildup to sustain peak data integrity during heavy workloads while avoiding physical clearance issues with oversized desktop CPU air coolers.